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BGA 植球套件
正常价格
Rp 979.000,00
单价
/
不可用
BGA 植球套件 被订购，并将一旦恢复库存就会发货。
无法加载拾取可用性
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Delivery and Shipping
Delivery and Shipping
Shipping & Processing
Order Processing
- Same business-day for orders placed before 3 PM (GMT), except in rare cases when it may take 1 additional business day.
- Larger or specialist items require up to 3 business days to process.
Delivery Options
- Royal Mail 48
- Free on orders over £20
- £2.99 on orders under £20
- Delivery in 2–3 business days
- Tracked 24 (Next-Day) — £4.99
-
Standard (Large & Specialist Items)
- Free on orders over £20
- £6.99 on orders under £20
- Delivery in 2–14 business days (typically around 7 days)
- Processing may take up to 3 business days
- International
- We ship worldwide. Delivery options and estimated timeframes for your country are available at checkout.
- Customs, duties, and import taxes are your responsibility.
You’ll receive tracking details as soon as your order ships [track your order here]. For full details, please see our [Shipping Policy].
BGA 植球套件
Rp 979.000,00
BGA 植球套件
特征：
- 材料： 全铝镀层，耐氧化，耐磨。
- 兼容性： 适合芯片尺寸从5毫米到50毫米，适用于台式电脑、笔记本电脑、BGA芯片和手机。
- 可调节性： 包括带有刻度的可调节平面螺丝，用于精确测量。
- 方面： 90mm x 90mm 植球站。
包括：
- 模板：0.3mm、0.35mm、0.4mm、0.45mm、0.5mm、0.55mm、0.6mm（通用、0.9、1.0）、0.76mm
- 手柄和六角扳手，方便操作。
该套件的设计注重耐用性和易用性，非常适合精确的 BGA 植球任务。
