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Perlengkapan Reballing BGA

£65.13
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Description

Perlengkapan Reballing BGA

Fitur:

  • Bahan: Semua pelapisan aluminium, tahan terhadap oksidasi dan keausan.
  • Kesesuaian: Cocok untuk ukuran chip dari 5mm hingga 50mm, cocok untuk PC desktop, laptop, chip BGA, dan ponsel.
  • Kemampuan penyesuaian: Dilengkapi sekrup bidang yang dapat disesuaikan dengan skala untuk pengukuran yang tepat.
  • Ukuran: Stasiun reballing 90mm x 90mm.

Termasuk:

  • Stensil: 0,3mm, 0,35mm, 0,4mm, 0,45mm, 0,5mm, 0,55mm, 0,6mm (Universal, 0,9, 1,0), 0,76mm
  • Tangkai tangan dan kunci hex untuk pengoperasian mudah.

Kit ini dirancang agar tahan lama dan mudah digunakan, membuatnya ideal untuk tugas reballing BGA yang presisi.

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