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Perlengkapan Reballing BGA
Rp 1477000.00
Unit price
/
Unavailable
Perlengkapan Reballing BGA is backordered and will ship as soon as it is back in stock.
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Delivery and Shipping
Delivery and Shipping
Enjoy free shipping on all orders. We dispatch purchases within 1-2 business days for swift delivery, but please note that in some cases, such as international shipments, dispatch and delivery times may be longer.
Description
Description
Perlengkapan Reballing BGA
Fitur:
- Bahan: Semua pelapisan aluminium, tahan terhadap oksidasi dan keausan.
- Kesesuaian: Cocok untuk ukuran chip dari 5mm hingga 50mm, cocok untuk PC desktop, laptop, chip BGA, dan ponsel.
- Kemampuan penyesuaian: Dilengkapi sekrup bidang yang dapat disesuaikan dengan skala untuk pengukuran yang tepat.
- Ukuran: Stasiun reballing 90mm x 90mm.
Termasuk:
- Stensil: 0,3mm, 0,35mm, 0,4mm, 0,45mm, 0,5mm, 0,55mm, 0,6mm (Universal, 0,9, 1,0), 0,76mm
- Tangkai tangan dan kunci hex untuk pengoperasian mudah.
Kit ini dirancang agar tahan lama dan mudah digunakan, membuatnya ideal untuk tugas reballing BGA yang presisi.
Payment & Security
Payment methods
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