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BGA Reballing Kit

Reguliere prijs 1,967.00 ฿

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BGA Reballing Kit

BGA Reballing Kit

1,967.00 ฿

BGA Reballing Kit

Kenmerken:

  • Materiaal: Volledig aluminium coating, bestand tegen oxidatie en slijtage.
  • Compatibiliteit: Geschikt voor chipformaten van 5mm tot 50mm, geschikt voor desktop PC's, laptops, BGA-chips en mobiele telefoons.
  • Verstelbaarheid: Inclusief een verstelbare vlakschroef met een schaal voor nauwkeurige metingen.
  • Afmetingen: 90mm x 90mm reballingstation.

Inclusief:

  • Stencils: 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm, 0.55mm, 0.6mm (Universeel, 0.9, 1.0), 0.76mm
  • Handgreep en inbussleutel voor gemakkelijke bediening.

Deze kit is ontworpen voor duurzaamheid en gebruiksgemak, waardoor het ideaal is voor nauwkeurige BGA reballing taken.