BGA Reballing Kit

In stock

Description:

BGA Reballing Kit

Features:

• Material: All aluminum plating, resistant to oxidation and wear.
• Compatibility: Fits chip sizes from 5mm to 50mm, suitable for desktop PCs, laptops, BGA chips, and mobile phones.
• Adjustability: Includes an adjustable plane screw with a scale for precise measurements.
• Dimensions: 90mm x 90mm reballing station.

Includes:

• Stencils: 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm, 0.55mm, 0.6mm (Universal, 0.9, 1.0), 0.76mm
• Hand shank and hex wrench for easy operation.

This kit is designed for durability and ease of use, making it ideal for precise BGA reballing tasks.